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Publications
Shui Jiang, Yi-Hua Chung , Chih-Chun Chang, Tsung-Yi Ho, and Tsung-Wei Huang, “BQSim: GPU-accelerated Batch Quantum Circuit Simulation using Decision Diagram, “ ACM International Conference on Architectural Support for Programming Languages and Operating Systems (ASPLOS) , Rotterdam, Netherlands, 2025
Boyang Zhang, Che Chang, Cheng-Hsiang Chiu, Dian-Lun Lin, Yang Sui, Chih-Chun Chang, Yi-Hua Chung , Wan-Luan Lee, Zizheng Guo, Yibo Lin, and Tsung-Wei Huang, “iTAP: An Incremental Task Graph Partitioner for Task-parallel Static Timing Analysis, “ IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC) , Tokyo, Japan, 2025
Che Chang, Boyang Zhang, Cheng-Hsiang Chiu, Dian-Lun Lin, Yi-Hua Chung , Wan-Luan Lee, Zizheng Guo, Yibo Lin, and Tsung-Wei Huang, “PathGen: An Efficient Parallel Critical Path Generation Algorithm, “ IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC) , Tokyo, Japan, 2025
Chen, Han-Ting, Yi-Hua Chung, Vincent Hwang, and Bo-Yin Yang. “Algorithmic Views of Vectorized Polynomial Multipliers–NTRU (2023). “ Indocrypt, 2023
Chen, Han-Ting, Yi-Hua Chung, Vincent Hwang, Chi-Ting Liu, and Bo-Yin Yang. “Algorithmic Views of Vectorized Polynomial Multipliers for NTRU and NTRU Prime (Long Paper). “ Cryptology ePrint Archive, Paper 2023/541. 2023
Yi-Hua Chung . 2022. Enlarging quantum circuit simulation and analysis with non-volatile memories. Master’s thesis. National Taiwan University, No. 1, Sec. 4, Roosevelt Rd., Taipei 106216, Taiwan (R.O.C.)
Chung, Yi-Hua, Cheng-Jhih Shih, and Shih-Hao Hung. “Accelerating simulated quantum annealing with GPU and tensor cores. “ In International Conference on High Performance Computing, pp. 174-191. Cham: Springer International Publishing, 2022
Chung, Yi-Hua, Huang Jun-Fu, Hu Yuan-Chen, and Huang Chen-Kang. “Development of a Small Intelligent Weather Station for Agricultural Applications. “ Advances in Technology Innovation 6, no. 2 (2021): 74.
[Best Paper Award ] in the 9th international multi-conference on Engineering and Technology Innovation, 2020